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- User Manual for SCENE
- Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm
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German-English translation for "Betriebsanleitung"
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User Manual for SCENE
Alongside the process parameters, the physical properties of the solution or photoresist determine the thickness of the applied film. The GYRSET principle entails synchronous rotation of the process chamber during coating, in this way effectively reducing air turbulence over the rotating substrate. The atmosphere within the closed chamber becomes more quickly saturated with solvents, so that the resist dries more slowly and is thus distributed more evenly over the substrate.
This results in significant savings in terms of required material. Puddle developing involves dispensing a defined quantity of developer to the exposed substrate, gently spinning it to spread the developer. Due to the surface tension of the developing agent, a convex puddle is formed on the wafer.
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Once developing time is completed, the wafer is rotated quickly to spin off the developer agent. The wafer is subsequently rinsed with deionized water and dried, once again at a high rotation speed. The main advantage of the technique is that only very little developing agent is required while maintaining excellent process results.
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Puddle developing is no longer feasible when the developing agent becomes saturated, for example when a large quantity of photoresist needs to be removed or a high structural topography prevents exchange of the developer. In such cases, a multi-stage puddle developing process or spray developing is used.
Laboratory Spin Coat and Develop Solution for Wafers up to 150 and 200mm
Beside some overall requirements all labs have different needs which arise from their specialized topics. This is why SUSS MicroTecs LabSpin tools are well designed and rock solid built basic coaters but can be equipped with various carefully selected options. This configurator will guide you in a few easy steps to your perfect new lab tool.